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Core I5-6300U SR2F0 Intel Core Processor Laptop I5 Series 3MB Cache Up To 3.0GHz

Product Details
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Model Number: i5-6300U SR2F0
Certification: ORIGINAL PARTS
Minimum Order: 1 piece
Price: Negotiation
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 1000pcs
Delivery Time: 3-5 work days
Packaging Details: tray, 10cmX10cmX5cm
Porcessor Number: I5-6300U
Product Collection: 6th Generation Core i5 Processors
Code Name: Skylake
Market Segment: Mobile
Status: Launched
Launch Date: Q3'15
Lithography: 14nm
Use Conditon: Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet
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Description

Laptop CPU Processors

Core I5-6300U SR2F0 Laptop CPU Processors Core I5 Series (3MB Cache,up to 3.0GHz ) - Notebook CPU The Core i5-6300U is an ULV (ultra low voltage) d...

Core I5-6300U SR2F0 Laptop CPU Processors Core I5 Series (3MB Cache,up to 3.0GHz ) - Notebook CPU


The Core i5-6300U is an ULV (ultra low voltage) dual-core SoC based on the Skylake architecture and has been launched in September 2015. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.4 - 3.0 GHz (2 cores: max. 2.9 GHz), the chip also integrates an HD Graphics 520 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Processor number i5-6300U

Processor number i5-6300U
Family Core i5 Mobile
Technology (micron) 0.014
Processor speed (GHz) 2.4
L2 cache size (KB) 512
L3 cache size (MB) 3
The number of cores 2
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

General Information:

Type CPU / Microprocessor
Market segment Mobile
Family
Intel Core i5 Mobile
Model number
i5-6300U
Frequency 2400 MHz
Maximum turbo frequency 3000 MHz (1 core)
2900 MHz (2 cores)
Clock multiplier 24
Package 1356-ball micro-FCBGA
Socket BGA1356
Size 1.65" x 0.94" / 4.2cm x 2.4cm
Introduction date September 1, 2015 (announcement)
September 1, 2015 (availability in Asia)
September 27, 2015 (availability elsewhere)

Architecture Microarchiteture:

Microarchitecture Skylake
Processor core Skylake-U
Core stepping D1 (SR2F0)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size 2 x 256 KB 4-way set associative caches
Level 3 cache size 3 MB 12-way set associative shared cache
Physical memory 32 GB
Multiprocessing Not supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TXT / Trusted Execution technology
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
Low power features Enhanced SpeedStep technology

Integrated peripherals / components:

Display controller 3 displays
Integrated graphics GPU Type: HD 520
Graphics tier: GT2
Microarchitecture: Gen 9 LP
Execution units: 24
Base frequency (MHz): 300
Maximum frequency (MHz): 1000
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • PCI Express 3.0 interface (12 lanes)
  • SATA controller
  • USB controller
  • USB OTG
  • eMMC 5.0
  • SDXC 3.0
  • Legacy I/O


Electrical / Thermal parameters:

Maximum operating temperature 100°C
Thermal Design Power 15 Watt
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